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Intel® RealSense™ Robotic Development Kit powered by UP

ShenZhen, China, April 13, 2016 - During the Keynote of Intel Developer Forum 2016 in Shenzhen, Intel Corporate Vice President Ian Yang, on behalf of C.E.O. Brian Krzanich, announced Intel® RealSense™ Robotic Development Kit powered by UP.

The Robotic Development Kit will be priced at $249 and the preorder is now available. The depth-sensing camera, Intel® RealSense™ R200, can recognize items and determine the size, shape and contours of an object. This development kit supports Linux for the first time and provides API’s which interface with ROS (Robotics Operating System) in a cross platform. Creating an intelligent robot has never been so easy and affordable.

The UP board was selected to be a part of the development kit because of a wide range of operating systems support, such as Linux (Ubilinux, Ubuntu, Yocto), Android and Microsoft Windows. Due to the versatility of its 40 pin I/O connector, it is compatible with some of the existing Raspberry Pi2 expansions.
 
UP Bridge The Gap Founder Fabrizio Del Maffeo said: “The cooperation with Intel RealSense for the Robotic Development Kit is a milestone for UP. This is just more proof that the market strongly believes that the UP board is the perfect solution for professional makers in the industrial and robotics field. RealSense gives robots a real sight!”
In the interim, the UP team is working on validating industrial field bus protocols such as CAN bus, EtherCAT and Profinet generally used to communicate with industrial robots and industrial machineries.
Follow the developments of the UP board at www.up-board.org and www.up-community.org
 

Preorder: Intel® RealSense™ Robotic Development Kit http://click.intel.com/intelr-realsensetm-robotic-development-kit.html

Intel® RealSense™ Camera (R200)  can be ordered at up-shop.org soon. 

Copyright ©Intel Corporation,, All rights reserved. Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95052-8119, USA. *The "Android" name and the Android logo are property of Google Inc. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Intel, the Intel logo, Intel Insider, Intel SpeedStep, Intel® RealSense™ and Atom are trademarks of Intel Corporation in the U.S. and/or other countries. All rights reserved. UP Bridge The Gap is Trademark of Aaeon Europe. All Rights reserved.

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