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Unique UPS for all UP Boards

By |May 4th, 2017|Kickstarter|0 Comments
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Unveiling UP Squared Chassis

By |April 22nd, 2017|Kickstarter|0 Comments
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Reward options for Kickstarter Backers

By |April 14th, 2017|Kickstarter|0 Comments
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UP Squared Innovator Kits have been shipped!

By |March 23rd, 2017|Kickstarter|0 Comments
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resin.io supports UP!

By |March 21st, 2017|Uncategorized|0 Comments
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Unveiling UP Core

By |March 17th, 2017|Kickstarter, Press release, Uncategorized|0 Comments
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Check UP at Embedded World

By |February 21st, 2017|Uncategorized|0 Comments
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Making UP a panel PC

By |February 13th, 2017|Uncategorized|0 Comments
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UP collaborate with Beabloo @Digital Sigange

By |February 7th, 2017|Press release|0 Comments
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UP Squared development update

By |February 7th, 2017|Uncategorized|0 Comments
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The "Android" name and the Android logo are property of Google Inc. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Intel, the Intel logo, Intel Insider, Intel SpeedStep, and Atom are trademarks of Intel Corporation in the U.S. and/or other countries. All rights reserved. UP Bridge The Gap is Trademark of Aaeon Europe. All Rights reserved.